Wired
Next week (August 12), Honor will hold the most important press conference of this year, officially launching the first top flagship product after independence, and it is also the most powerful mobile phone in Honor’s history-Honor Magic3.
Recently, Xinhua News Agency has carried out a series of reports on Honor and its various technologies. Previously, Honor CEO Zhao Ming and Chinese Go chess San Nie Weiping and former CCTV host Zhang Quanling discussed their imagination about AI technology and revealed some Information about Honor Magic3.
video
Today, the three of them walked into the Honor R&D Center together and exposed the whole process of the birth of the Magic3 series in advance. They witnessed the core functions of the machine such as waterproof, drop, heat dissipation and call. They not only exposed the real Magic3 machine, but also Once again revealed some new details about the aircraft.
The video first shows the waterproof performance test of Honor Magic3. It can be seen that in the simulated deep water test, the machine has passed the challenge of pressurized simulation of 3-4 meters or even deeper water, and achieved industry-leading waterproof performance. Calling on rainy days No effect.
Honor Magic3 has excellent waterproof performance
In addition, Zhao Ming also announced in advance that the Honor Magic 3 uses the industry-leading 3D nanocrystalline process, which can take into account the hardness and strength of ceramic materials, as well as the 3D plasticity and high transparency of glass materials. It is excellent in robustness and aesthetics. And it passed the drop test perfectly.
Honor Magic 3 uses 3D nano-crystal technology to have stronger anti-drop performance
With the continuous improvement of the current mobile phone performance, the heat dissipation requirements inside the mobile phone are getting higher and higher, especially the chip area is a big heat generator, and the heat dissipation performance of the mobile phone has become the top priority of ensuring the experience.
Zhao Ming introduced that Honor Magic 3 uses ultra-high thermal conductivity brand new graphene for heat dissipation. This is a material with very high thermal conductivity. After the AI technology is blessed, the performance of the chip can be maximized.
Honor Magic 3 is equipped with graphene heat dissipation, which can quickly dissipate heat
This is also consistent with the information previously disclosed by Zhao Ming. He once said at the release of the Honor 50 series that the current experience of the Snapdragon 888 models on the market is messed up, and the main reason for this is the heat caused by the heat caused by the chip. The performance cannot be achieved when the frequency is reduced.
At that time, Zhao Ming said that Honor Magic 3 will bring a full-blooded Snapdragon 888 chip experience, which not only means that the machine will be equipped with a higher frequency Snapdragon 888 Plus, but also represents the heat dissipation performance of Honor’s Magic3. With great confidence, it will perfectly display the ultimate performance of this Android’s strongest core, which is worth looking forward to.
Please indicate the source for reprinting: Fast Technology
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