Wired
It has been observed that Huawei, which has a strong presence in the smartphone industry despite being in a difficult situation, will adopt a new hinge that is not available in its predecessor in the next-generation foldable smartphone.
Fast-growing folding smartphone market
Currently, Samsung, known for its Galaxy Z Flip / Fold series, is leading the folding smartphone market, but it is still a growing technology and faces various challenges.
The original Galaxy Fold, for example, suffered significant durability issues and delayed its launch significantly from its original schedule. From the original Z Flip, even a brush that scrapes out dust inside is installed to prevent dust from entering the hinge that is the heart of folding.
Huawei, which was reported to have started mass production of new folding smartphones the other day, is said to be adopting a next-generation hinge that has never been seen before. According to people familiar with the matter, Huawei has been working on the development of hinge designs for quite some time, aiming for a simple structure with a small number of parts. As a result, the price is kept down and the durability is improved.
Can you overcome the handicap that does not support 5G?
Huawei’s next-generation foldable smartphone is expected to be a clamshell type that is conscious of competing with Samsung’s Galaxy Z Flip3. Although it is a type that becomes a compact square when folded, it is characterized by being less expensive than the Flip3. The name is “Huawei Mate V” and it is expected to be released in December.
Huawei’s strategy seems right, given that the Flip3, which is by no means cheap, is gaining popularity around the world. However, Huawei is currently unable to develop 5G compatible chips in-house due to the U.S. government’s embargo, and Qualcomm, which is the line of trust, only supplies non5G compatible chips, so how much consumer interest can be bought in terms of hardware. I don’t know.
Source: GSMArena, LETSGODIGITAL
(kihachi)
Source: iPhone Mania