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iPhone 15 Pro real machine teardown revealed!Hidden “innovation highlights” that Apple didn’t mention are the first in the world – Free Electronic News 3C Technology

The new generation iPhone 15 Pro high-end flagship series launched by Apple this year is equipped with A17 Pro chip and three cameras on the back. (Photo/photo by reporter Huang Zhaoxiang)

Apple this year launched a new generation of iPhone 15 Pro and iPhone 15 Pro Max high-end flagship series equipped with A17 Pro chips. They were officially launched on Friday (9/22). Thanks to TSMC’s A17 Pro chip based on the three-nanometer process, the iPhone 15 Pro series has ray tracing technology that supports hardware acceleration, which enhances the overall phone performance and can even play AAA-level game masterpieces with high image quality. It is also more than competent.

In addition to the industry-leading three-nanometer A17 Pro chip, a real-life iPhone 15 Pro disassembly report released by research firm TechInsights points out that Apple has a hidden upgrade to the internal parts of the iPhone 15 Pro series. The advantage is that it is equipped with the ultra-high-density D1β (D1b) LPDDR5 16 Gb DRAM developed by Micron, the most advanced semiconductor memory chip module on the planet.

Apple launched a new generation of iPhone 15 Pro high-end flagship series dual-machine this year. Foreign media dismantled the inside of the fuselage and found that Apple also used Micron D1β LPDDR5 DRAM, the most advanced process in history, which has the characteristics of small size and ultra-high density. Brings significant improvements in performance, bit density and power efficiency. This chip is installed on the iPhone 15 Pro mobile phone for the first time, which is the first time in the world. (Photo courtesy of Techinsights)

This advanced process DRAM mobile memory chip module was publicly announced by Micron in November last year and sent qualified samples to smartphone manufacturers. Micron officially claims that when mass-produced using advanced DRAM technology nodes, the chipset has the characteristics of ultra-low power consumption, ultra-low latency and high performance, and can provide the highest speed level of up to 8.5Gbps per second. It was the first in the world to be used by Apple on the iPhone 15 Pro series of dual-phone models. This also proves that Apple has taken a major innovative step in the field of smart phones, which has great index significance in leading industry trends.

In this regard, foreign media Appleinsider reported and analyzed that Micron’s D1β (D1b) LPDDR5 16 Gb DRAM technology has the characteristics of ultra-high bit density and smaller size. The biggest advantage for Apple’s iPhone 15 Pro mobile phone is that it can be used in Without sacrificing the internal space of the motherboard or the fuselage, it also frees up some extra space inside the mobile phone so that larger-capacity batteries or other chips can be placed.

Incidentally, in order to differentiate its products from its competitors, Micron has specifically avoided the EUV (extreme ultraviolet lithography process) used by Samsung and Hynix in mobile memory chip modules. In other words, , without going through the EUV process, the D1β (D1b) LPDDR5 chip technology successfully developed by Micron can achieve the same function, and also reduce the size of the chip module, and at the same time bring more The role of energy efficiency in saving energy.

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