Wired
The realme GT2 Master Explorer Edition is scheduled to be officially released on July 12. Xu Qi, vice president of realme, hinted that this time, the exploration version 2 has brought a lot of world-leading technologies for the first launch, which many netizens are looking forward to.
Today, Real Wo officially brings new news about Real Wo GT2 Master Exploration Edition, which will use the strongest heat dissipation in the history of Real Wo mobile phones – dual VC ice core cooling MAX.
According to reports, this heat dissipation scheme is different from the conventional single-sided conduction. It adopts a sandwich three-dimensional double VC structure, and the VC area is as high as 4811m2, claiming that the heat dissipation is comparable to that of a gaming phone.
This morning, Realme officially announced that the Realme GT2 Master Explorer Edition has a built-in LPDDR5X chip, which is the world’s first. Compared with the previous generation LPDDR5 memory chip, the power consumption is reduced by 20% while maintaining high-speed transmission.
In addition, the phone will be equipped with the Qualcomm Snapdragon 8+ flagship processor, equipped with a 120Hz ultra-narrow sky screen with a side width of only 1.48mm. The phone also adopts the COP packaging process to shorten the chin to 2.37mm, making the screen ratio as high as 2.37mm. 94.2%.
The Realme GT2 Master Explorer Edition has also made great efforts in design. It is designed by Jae Jung, an internationally renowned fashion designer. The right-angle metal middle frame in the shape of a hard box is made of environmentally friendly plain leather on the back and decorated with metal rivets. full.
I believe that this texture flagship will have more starting technologies, waiting for the official announcement for us.
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