Wired
Vadim Yuryev of technology channel Max Tech said that Apple’s M3 Ultra chip is expected to adopt a new design and appear as an independent chip, rather than being composed of two M3 Max chips like the previous M1 Ultra and M2 Ultra.
This speculation comes from another blogger @techanalye1 who noticed that the M3 Max chip seems to have eliminated the UltraFusion bridge interconnect technology used to connect the two chips. Therefore, Yuryev speculates that the upcoming M3 Ultra chip will no longer be implemented by packaging two M3 Max chips, and is expected to become the first independently designed Apple Ultra series chip in history.
Independent design will allow Apple to customize the M3 Ultra for professional, high-intensity workflows. For example, Apple could completely remove the energy-efficiency core and switch to a full-performance core design while adding more GPU cores. With this design alone, the performance improvement of a single M3 Ultra will almost certainly exceed the improvement of M2 Ultra compared to M2 Max, because there is no longer the efficiency loss caused by UltraFusion interconnect technology.
Yuryev also boldly speculated that M3 Ultra may have a new UltraFusion interconnect technology, allowing two M3 Ultra chips to be packaged to create an “M3 Extreme” chip with twice the performance. Compared with packaging four M3 Max chips, this design will bring better performance improvements and may also support larger-capacity unified memory.
There is currently little exact information about the M3 Ultra, but there is news that it will use TSMC’s N3E process technology, which is the same as the A18 chip equipped in the iPhone 16 series to be released in the second half of the year. This also means that this will be Apple’s first chip using the N3E process. Rumors indicate that the M3 Ultra will be released with the new Mac Studio in mid-2024.
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