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While the M1 Ultra and M2 Ultra are manufactured by connecting two M1 Max and M2 Max with an interconnect pad, the M3 Max is not equipped with an interconnect pad, so it seems that the M3 Ultra will be announced. TechInsights points out that there is a possibility that it will also be a newly designed chip.
Why not make the M3 Ultra based on the M3 Max?
Based on TechInsights’ points, the M3 Ultra cannot be designed and manufactured like the M1 Ultra or M2 Ultra.
TechInsights cites two possibilities as to why the M3 Max doesn’t have an interconnect pad.
- It is cheaper to manufacture the M3 Ultra separately than to connect two M3 Max.
- Apple is considering packaging that could turn into interconnect pads, potentially allowing it to connect two systems-on-chip (SoC) more efficiently.
The latter possibility is in line with rumors that the M3 Ultra may have an interconnect pad that could be used to connect the two to create the M3 Extreme.
However, if it is as TechInsights points out, another technology may be used instead of interconnect pads.
M3 Ultra will not appear, and M4 Ultra may adopt a new design
The M3 Ultra is expected to be installed in Mac Studio and Mac Pro by the end of 2024, but Apple is planning to shift the chips installed in all Macs to the M4 series from the end of 2024 to next year. There are also rumors that Ultra may not appear.
The packaging that can be turned into an interconnect pad is a technology used in the previously rumored Apple Car chip, and it is possible that the M4 Ultra and M4 Extreme will be announced using this technology.
Source:TechInsights
Photo:9TechEleven (@9techeleven)/X
Source: iPhone Mania